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AN815
Vishay Siliconix
Front of Board SC70-6
Back of Board SC70-6
vishay.com
FIGURE 3.
THERMAL PERFORMANCE
R q JA
P D + 150 C o * 25 C
R q JA
P D + 150 C o * 60 C
Junction-to-Foot Thermal Resistance
(Package Performance)
The junction to foot thermal resistance is a useful method of
comparing different packages thermal performance.
A helpful way of presenting the thermal performance of the
6-Pin SC-70 copper leadframe device is to compare it to the
traditional Alloy 42 version.
COOPER LEADFRAM E
Room Ambient 25 _ C
T J(max) * T A
P D +
o o
124 C W
P D + 1.01 W
Elevated Ambient 60 _ C
T J(max) * T A
P D +
o o
124 C W
P D + 726 mW
R q JA
R q JA
P D + 150 C o * 25 C
P D + 150 C o * 25 C
329.7 _ C/W
208.5 _ C/W
2) Industry standard 1-inch 2 PCB with
211.8 _ C/W 103.5 _ C/W
Thermal performance for the 6-pin SC-70 measured as
junction-to-foot thermal resistance, where the “foot” is the
drain lead of the device at the bottom where it meets the PCB.
The junction-to-foot thermal resistance is typically 40 _ C/W in
the copper leadframe and 163 _ C/W in the Alloy 42 leadframe
— a four-fold improvement. This improved performance is
obtained by the enhanced thermal conductivity of copper over
Alloy 42.
Power Dissipation
The typical R q JA for the single 6-pin SC-70 with copper
leadframe is 103 _ C/W steady-state, compared with 212 _ C/W
for the Alloy 42 version. The figures are based on the 1-inch 2
FR4 test board. The following example shows how the thermal
resistance impacts power dissipation for the two different
leadframes at varying ambient temperatures.
ALLOY 42 LEADFRAME
Room Ambient 25 _ C Elevated Ambient 60 _ C
T J(max) * T A T J(max) * T A
P D + P D +
o o o o
212 C W 212 C W
P D + 590 mW P D + 425 mW
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2
As can be seen from the calculations above, the compact 6-pin
SC-70 copper leadframe LITTLE FOOT power MOSFET can
handle up to 1 W under the stated conditions.
Testing
To further aid comparison of copper and Alloy 42 leadframes,
Figure 5 illustrates single-channel 6-pin SC-70 thermal
performance on two different board sizes and two different pad
patterns. The measured steady-state values of R q JA for the
two leadframes are as follows:
LITTLE FOOT 6-PIN SC-7 0
Alloy 42 Copper
1) Minimum recommended pad pattern on
the EVB board V (see Figure 3.
maximum copper both sides.
The results indicate that designers can reduce thermal
resistance (R q JA ) by 36% simply by using the copper
leadframe device rather than the Alloy 42 version. In this
example, a 121 _ C/W reduction was achieved without an
increase in board area. If increasing in board size is feasible,
a further 105 _ C/W reduction could be obtained by utilizing a
1-inch 2 square PCB area.
The copper leadframe versions have the following suffix:
Single: Si14xxEDH
Dual: Si19xxEDH
Complementary: Si15xxEDH
Document Number: 71334
12-Dec-03
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相关代理商/技术参数
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